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March 2003: News From Booktech

We’re back from this year’s BookTech show, and from what we saw it was quite a success. The show was held March 3-4 in New York City, and it’s one of the premier book shows of the year. This is where many publishers and book manufacturers come to find new ideas they will put into effect throughout the year. To that end, we were very pleased with the number of attendees who showed a great deal of enthusiasm for discovering new designs and production methods.

   

As the publishing market becomes increasingly competitive, it’s important to find new ways to make products stand out. At Eckhart and Company, we felt it was important to be a part of that by making publishers and book manufacturers aware of alternative binding options, cover designs and materials and more. Among the most frequently-discussed designs at our BookTech booth was cased-in Wire-O binding. This hardcover binding style utilizes turned-edge construction for a wide range of decorating options. Many publishers and book manufacturers we spoke with were particularly interested in the potential for designing cased-in Wire-O books and matching turned-edge-decorated slipcases.

   

We also found it very encouraging that many of our customers had their design and production teams scouring the show for new ideas. When more people in an organization are exposed to new possibilities, the better the chance that company has of creating more value for their customers and winning more business.

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