
March 2003: News From Booktech
We’re back from this year’s BookTech show,
and from what we saw it was quite a success. The show was held March 3-4 in New
York City, and it’s one of the premier book shows of the year. This is where
many publishers and book manufacturers come to find new ideas they will put into
effect throughout the year. To that end, we were very pleased with the number of
attendees who showed a great deal of enthusiasm for discovering new designs and
production methods.
As the publishing market becomes
increasingly competitive, it’s important to find new ways to make products
stand out. At Eckhart and Company, we felt it was important to be a part of that
by making publishers and book manufacturers aware of alternative binding
options, cover designs and materials and more. Among the most
frequently-discussed designs at our BookTech booth was cased-in Wire-O binding.
This hardcover binding style utilizes turned-edge construction for a wide range
of decorating options. Many publishers and book manufacturers we spoke with were
particularly interested in the potential for designing cased-in Wire-O books and
matching turned-edge-decorated slipcases.
We also found it very encouraging that many of our
customers had their design and production teams scouring the show for new ideas.
When more people in an organization are exposed to new possibilities, the better
the chance that company has of creating more value for their customers and
winning more business.
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